Methods for manufacturing ultrasound transducers and other components

ABSTRACT

The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/657,783 filed Oct. 22, 2012, which is a continuation-in-part of U.S.patent application Ser. No. 12/562,998 filed Sep. 18, 2009, which claimsthe benefit of U.S. Provisional Application Nos. 61/192,661 and61/192,690, both filed on Sep. 18, 2008 and all of which are herebyincorporated by reference in their entirety.

FIELD OF THE DISCLOSED TECHNOLOGY

The disclosed technology relates to the fields of manufacture ofelectrical components such as ultrasound transducers.

SUMMARY OF THE DISCLOSED TECHNOLOGY

In general, the disclosed technology provides methods for manufacturingelectrical components, such as arrayed ultrasonic transducers.

As will be described in further detail below, the disclosed technologyrelates to making connections to between traces on a printed circuit andan array of transducer elements. In one embodiment, traces that carrysignals to and receive signals from transducer elements are disposed ona printed flex circuit. Adjacent transducer elements to which the tracesare to be connected are spaced closer together than the distance theminimum distance that can be achieved between the conductors on theprinted flex circuit. Therefore, embodiments of the disclosed technologyemploy a multi-layer printed flex circuit having traces therein, wherebythe distance between adjacent traces on any single layer of themulti-layer flex circuit are spaced farther apart than the distancebetween adjacent transducer elements in the transducer array. In oneembodiment, a single multi-layer printed flex circuit is used to connectto one side of all of the ultrasound transducer elements. In anotherembodiment, two multi-layer printed flex circuits connect to oppositesides of the transducer elements so that one multi-layer printed flexcircuit connects to the even numbered transducer elements while theother multi-layer printed flex circuit connects to the odd numberedtransducer elements.

In one embodiment, a single four-layer printed flex circuit is used toconnect to the transducer elements such that the traces on any givenlayer connect to every fourth transducer element on a side of anultrasonic transducer. If two, four-layer printed flex circuits are usedsuch that the traces on each printed flex circuit connect to only evenor odd numbered transducer elements, then the traces on any given layerof a multi-layer printed flex circuit can be spaced by the distancebetween 8 transducer elements.

In one embodiment, the traces in each printed flex circuit are routed ina path that extends in a direction that is approximately parallel to thelong length of the transducer array. In another embodiment, the tracesin each printed flex circuit extend in a direction that is substantiallyaligned with the short length of the transducer array.

In one embodiment, the traces in the multi-layer printed flex circuitsare connected to transducer elements by securing the multi-layer printedflex circuit to the ultrasound transducer with a particulate filledepoxy material. The epoxy material may be molded or machined to providea smooth transition from the flex circuits to the transducer elements.Channels are then formed in the epoxy material between transducerelements and traces in the layers of the printed flex circuit. Once thechannels have been created, the channels over the printed flex circuitand the ultrasound transducer are then coated with a metallic conductorand a resist. A laser is then used to remove the resist and expose themetallic conductor in areas where it is not wanted. An etch processesthen removes most of the exposed metallic conductor and a laser canremove the remainder if necessary. The resist that is located over theareas where the metallic conductor is desired is then removed with asolvent. The remaining metallic conductor forms the electricalconnections between the transducer elements and a corresponding tracesin the multi-layer printed flex circuit.

Advantages of the disclosed technology will be set forth in part in thedescription which follows, and in part will be obvious from thedescription, or may be learned by practice of the disclosed technology.The advantages of the disclosed technology will be realized and attainedby means of the elements and combinations particularly pointed out inthe appended claims. It is to be understood that both the foregoinggeneral description and the following detailed description are exemplaryand explanatory only and are not restrictive of the disclosedtechnology, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an exemplary schematic piezoelectricstack (not to scale), showing a PZT layer, a ground electrode layermounted to a portion of the top surface of the PZT layer and extendingoutwardly beyond the longitudinal edges of the PZT layer, a first and asecond matching layer mounted on a portion of the top surface of theground electrode layer, a lens, a fourth matching layer mounted to thebottom surface of the lens, a third matching layer mounted to a portionof the top surface of the second matching layer and the bottom of thefourth matching layer, and a dielectric layer underlying the inactivearea of the transducer. Further showing a plurality of spacers formedthereon the top surface of the ground electrode layer that extendupwardly a predetermined distance relative to the top surface of the PZTlayer such that the bottom surface of the fourth matching layer can bepositioned at a desired distance relative to the PZT layer and theintervening first and second matching layers.

FIG. 2 is a schematic cross-sectional view of an exemplary lens (not toscale).\

FIG. 3 is an exemplary cross-sectional view of the PZT stack of FIG. 1showing the active and inactive areas of the transducer.

FIG. 4 is a cross-sectional view of the completed PZT stack shownmounted to a support member and showing the backing layer and dielectriclayer. The signal electrodes (which are not shown herein but overlayportions of the dielectric layer between the array elements and therespective flex circuits) operatively couple the flex circuits toparticular array elements defined therein the PZT stack and the groundelectrodes are electrically coupled to the ground of the respective flexcircuits.

FIG. 5 is a top plan view of the top of the PZT stack with matchinglayers 1 and 2 shown attached.

FIG. 6 is a top plan view of the top of the PZT stack with a copper foilmounted thereto with a conductive adhesive. Although the exemplifiedfoil extends beyond the azimuth length of the PZT stack, these two endflaps are eventually removed in a subsequent fabrication step.

FIG. 7 is a plan view of top of the PZT stack of FIG. 6, with the endflaps of the copper foil removed.

FIG. 8 is a top plan view of the top of the PZT stack with lens mountedthereto.

FIG. 9 is a top plan view of the top of the PZT stack showing the lensas a transparent layer in order to appreciate the alignment of theunderlying layers as well as the relative alignment and positioning ofthe copper foil, the spacers, and the radius of curvature of the lens.

FIG. 10 is a schematic cross-sectional view of the PZT stack after thePZT has been lapped to final target thickness and is ready to beintegrated with the flex circuit to create the array assembly. In thisembodiment, the remaining layers of the stack are completed afterwards.

FIGS. 11A and 11B are schematic views of an exemplary kerf pattern to bemachined into the PZT stack. In this aspect, the longer lines arerepresentative of the first kerf slots between array elements, and theshorter lines are representative of the second kerf slots, i.e., thesub-dice kerfs.

FIGS. 12A and 12B are a schematic top plan view and a perspective viewof a support member for use with the PZT stack of FIG. 10, showing afirst longitudinally extending side edge portion and an opposed secondlongitudinally extending side edge portion, each side edge portionhaving a respective inner surface and an opposed outer surface, whereina portion of the respective inner surfaces of the first and secondlongitudinally extending side edge portions are configured so that adistal portion of a circuit board, such as, for example and withoutlimitation, a flex circuit board, can be connected thereto, wherein thesupport member has a medial portion between the respective the first andsecond longitudinally extending side edge portions that defines acentral, longitudinally extending opening, wherein the PZT stack of FIG.10 is configured to mount on a portion of the medial portion of thesupport member.

FIG. 13 is a schematic cross-sectional view of the support member ofFIGS. 12A and 12B shown glued to the PZT stack of FIG. 10.

FIGS. 14A and 14B are schematic bottom plan views of the support memberwith the PZT stack fixedly mounted therein showing flex alignmentfeatures laser cut into the support structure and positioned withrespect to the respective array kerfs. In one aspect, the flex alignmentfeatures on the right are offset relative to the features on the left bya distance substantially equal to the pitch of the array. An enlargedtop plan view is also shown.

FIGS. 15A-15C are schematic bottom plan views of the support member withthe PZT stack fixedly mounted therein showing how the flex circuit pairis aligned with respect to the array kerfs. The red bars represent thecopper traces on the top side of the flex circuit.

FIG. 16 is a schematic cross-sectional view of the PZT stack after it isdie attached to the two flex circuits.

FIG. 17 is a schematic cross-sectional view showing an applieddielectric layer.

FIG. 18 is a schematic cross-sectional view of the finished dielectriclayer. In this aspect, the dielectric layer defines the elevationdimension of the array and provides a smooth transitional surface fromthe flex to the stack in preparation for the deposition of the signalelectrode.

FIG. 19 is a schematic of the signal electrode pattern of the signalelectrode layer. In this example, the orange bars represent the removedelectrode and the red bars represent the leadframe of each respectiveflex circuit. In this exemplary schematic, an additional electrodepattern above and below each flex circuit is shown.

FIGS. 20A and 20B are schematic views of the full signal electrodepattern for an exemplary 256 element transducer. The cyan box definesthe active area of the PZT stack and the pink box defines the perimeterof the blanket signal electrode. The laser trimming (orange) extendsbeyond the Au perimeter such that each signal electrode is isolated.

FIG. 21 is a schematic cross-sectional view illustrating the applicationof the backing material.

FIGS. 22A and 22B are schematic cross-sectional views of the arrayassembly mounted thereon the support member and prior to the depositionof the signal electrode pattern. FIG. 22A represents the array assemblybefore the ground connection to the flex circuits has been made, andFIG. 22B represents the array assembly after the ground connection hasbeen made such that the signal return path is completed.

FIG. 23 is a schematic view showing a pair of flex circuits connected toan exemplary PZT stack. In one exemplary embodiment, pin 1 (i.e.,element 1) of the assembly is indicated and is connected to the flexcircuit on the left of the array assembly. In this non-limiting example,the flex circuit to the left of the array assembly is connected to theodd elements, and the flex circuit to the right of the array assembly isconnected to the even elements.

FIG. 24 shows an exemplary ultrasonic transducer assembly constructed inaccordance with another embodiment of the disclosed technology.

FIG. 25 is a close up view showing how transducer elements areelectrically coupled to traces on a multi-layer printed flex circuit inaccordance with an embodiment of the disclosed technology.

FIGS. 26A and 26B are cross-sectional side views of a multi-layerprinted flex circuit showing how connections are made to traces throughan epoxy layer that covers a portion of the printed flex circuit.

FIG. 27 illustrates an ultrasound transducer that connects to a singlemulti-layer printed flex circuit in accordance with another embodimentof the disclosed technology.

FIG. 28 illustrates how individual connections between the traces in amulti-layer printed flex circuit and the transducer elements can have awidth that is less than a width of a transducer element.

FIG. 29 illustrates a multi-layer printed flex circuit having tracesthat extend generally in the direction of the width of the transducerarray in accordance with another embodiment of the disclosed technology.

DETAILED DESCRIPTION OF THE DISCLOSED TECHNOLOGY

The disclosed technology features methods for the manufacture ofelectrical components such as ultrasound transducers. In particular, thedisclosed technology provides methods of depositing materials, such asmetals, on surfaces; methods of patterning electrodes, e.g., in theconnection of an ultrasound transducer to an electrical circuit; andmethods of making integrated matching layer for an ultrasoundtransducer. The disclosed technology also features ultrasoundtransducers produced by the methods described herein.

Deposition of Materials

The disclosed technology provides improved methods for the adhesion ofmaterials to a surface, e.g., a thin film of metal or an adhesive suchas epoxy. The method involves use of a substrate of a compositematerial. The composite material includes a matrix material and aparticulate material, and the matrix material ablates at a lower laserfluence than the particulate material. When this substrate is ablated atan appropriate fluence, the matrix material is removed, but theparticulate material is retained unless all matrix material surroundingthe particles is removed. The result of the process is a highlythree-dimensional surface formed by a combination of the matrix andpartially exposed particulate material. The surface area of the newmorphology is greatly increased compared to the unablated surface. Amaterial, such as a metal or adhesive, is then deposited onto theablated surface, and adhesion is increased because of the morphologycreated by ablation. The improved adhesion preferably allows for laterablation of the material in selected areas without delamination of thematerial in unablated areas. An exemplary matrix material is a polymersuch as epoxy, and exemplary particulate materials are silica andsilicon carbide. An exemplary metal for deposition is gold. An adhesionlayer, e.g., containing chromium, may also be deposited for certainmetals, such as gold, as is known in the art. Examples of conditions anduses of the method are provided herein.

Patterning of Electrodes

The disclosed technology also provides a method for patterningelectrodes. This process can be used to connect any electrical componentthat can withstand the metallization step (highest temp ˜60-70° C.)directly to a flex or other circuit board type component. This methodcan be used to create features smaller than 5 μm over mm scale distancesin X, Y, and Z.

In general, the method involves providing an electrical componentneeding the patterning of electrodes. The component is coated with amaterial, such as the composite material described above. This coatingis generally ablated and selectively removed in the desired pattern ofthe electrodes. A conductive metal layer is then deposited over theablated surface. A resist is then applied over the metal layer. Becausethe coating was removed in the pattern of the electrodes, the metalapplied where the coating is removed is deposited in a trough or trench.These troughs or trenches are filled with resist, resulting in a thickerlayer of resist overtop of the pattern of the electrodes. The resist isthen removed from areas not forming part of the electrode pattern, andthe metal is etched. Any remaining metal and the coating in these areasare then ablated. Finally, the resist may be removed, resulting in theelectrode pattern. As is described in more detail herein, a portion ofthe electrical component, e.g., filler material in a kerf slot of atransducer, may be ablated to create a depression relative to thepatterned electrodes. Ablation at relatively high fluence in thesedepressions may then be employed to remove extraneous metal left behindby previous steps. The depression protects the patterned electrodes fromthe byproducts of ablation, which would otherwise likely result indelamination.

An exemplary use of the method is in making electrical connections to anarrayed ultrasound transducer. Each element of an array is typicallyconnected to a coaxial cable. At high frequencies (e.g., 20 MHz and up),the elements making up the array are typically too small and fragile forconventional wire bonding (which usually needs at least about 75 μm). Inaddition, thermal budgets required for wire bonding may also beproblematic. For high frequency transducers, wet etching may also beineffective because of the inability to hard bake resist because ofthermal budgets, as the resist may dissolver prior to removal of themetal. Laser ablation of the electrode may also be problematic, as thinfilms can be removed, but frequently crack, and thicker films (>about6000 Angstroms) providing crack resistance are prone to shorting becauseof splattering of metal during laser ablation. Also, the ablationprocess may cause collateral damage of the electrode. The method ofdisclosed technology, however, may be employed to make electricalconnections with elements of an array, e.g., with a pitch of 25 μm orless (e.g., less than 15 μm).

A laser that can be used for ablation in conjunction with the disclosedtechnology is a short wavelength laser such as a KrF Excimer lasersystem (having, for example, about a 248 nm wavelength or an argonfluoride laser (having, for example, about a 193 nm wavelength). Inanother aspect, the laser used to cut the piezoelectric layer is a shortpulse length laser. For example, lasers modified to emit a short pulselength on the order of ps to fs can be used. A KrF excimer laser system(UV light with a wavelength of about 248 nm) with a fluence range ofabout and between 0-20 J/cm² can be employed. Resist may be removed at afluence below that required to remove the conductive material (e.g.,less than 0.8 J/cm²). When it is desired to remove residual conductivemetal, adhesion layers, and the composite material as described hereinby ablation, the fluence may be between 0.8 to 1.0 J/cm². Ablation athigher fluences, e.g., up to 5 J/cm², may be employed to removecomposite material (and underlying portions of an electrical component)located in depressions.

Further examples of conditions and uses of the method are providedherein.

Integrated Matching Layer

The disclosed technology also features a process for making anintegrated matching layer. For high frequency applications, a lens forfocusing an ultrasound array is often manufactured as a separate part,which must be attached to the transducer. At high frequencies, the useof adhesives to attached the lens is complicated by the need to reduceany bondline to less than approximately 1 μm for 20 MHz and thin forhigher frequencies. Producing such bondlines presents challenges asfollows: i) large voids are created, when a small generally sphericalvoid in the adhesive is squeezed flat. Such voids can result fromwetting issues on either surface or from small trapped voids in theadhesive. ii) Squeezing the bondline to such dimensions can interferewith the mobility of the molecules in the adhesive and compromiseperformance. iii) In order to press a bondline to the appropriatedimension, surplus adhesive must be squeezed out from in between the twoparts being bonded. As the thickness of the bond decreases, the forcerequired to overcome shear forces within the adhesive increasesnonlinearly with the bond thickness and can quickly exceed acceptableforce budgets for the stack and/or lens materials. In order to ensurethat the bondline has no negative impact on the stack, the disclosedtechnology provides a method of making the bondline into a matchinglayer. This approach eliminates the need for an ultra thin layer andthus removes the concerns listed above.

The method employs spacers applied around the perimeter of thetransducer, and then lapped to the desired final height of the integralmatching layer. The matching layer is then made by curing the adhesivebetween the lens (and any matching layers attached to the lens) and thesurface to which the spacers are attached. If particles are employed inthe adhesive, e.g., to adjust the acoustical impedance, nano-particledopants may be employed to ensure that the resulting uncured glue can bepressed down onto the spacers without more than a fraction of a micronerror (due to particles being trapped between the top of the spacers,and the bottom of the lens). Spacers are desirably small to minimizetrapping of powder, but large enough to be accurately lapped to height,e.g., about 0.25 to 0.75 mm in diameter. The clamping force required forthis process is minimal, as the bondline is relatively thick, e.g.,between 5 and 25 μm) in the desired frequency range. Examples ofconditions and uses of the method are provided herein.

General Description of a Transducer

The disclosed technology will be further described with respect toultrasound transducers that can be produce with the methods describedherein. Components of the transducer stack, including piezoelectriclayers, matching layers, lenses, and backing layers are known in the artand described in U.S. Pat. No. 7,230,368, U.S. Publication No.2007/0222339, U.S. Publication No. 2007/0205698, and U.S. PublicationNo. 2007/0205697.

In one aspect, an ultrasonic transducer includes a stack having a firstface, an opposed second face, and a longitudinal axis Ls extendingbetween. The stack includes a plurality of layers, each layer having atop surface and an opposed bottom surface. In one aspect, the pluralityof layers of the stack includes a piezoelectric layer and a dielectriclayer (which may be deposited and patterned as described herein). In oneaspect, the dielectric layer is connected to and underlies at least aportion of the piezoelectric layer.

The plurality of layers of the stack can further include a groundelectrode layer, a signal electrode layer, a backing layer, and at leastone matching layer. Additional layers cut can include, but are notlimited to, temporary protective layers (not shown), an acoustic lens,photoresist layers (not shown), conductive epoxies (not shown), adhesivelayers (not shown), polymer layers (not shown), metal layers (notshown), and the like.

The piezoelectric layer can be made of a variety of materials. Forexample, materials that form the piezoelectric layer include ceramic,single crystal, polymer and co-polymer materials, ceramic-polymer andceramic-ceramic composites with 0-3, 2-2 and/or 1-3 connectivity, andthe like. In one example, the piezoelectric layer includes leadzirconate titanate (PZT) ceramic.

The dielectric layer can define the active area of the piezoelectriclayer. The dielectric layer can be applied to the bottom surface of thepiezoelectric layer. In one aspect, the dielectric layer does not coverthe entire bottom surface of the piezoelectric layer. In one aspect, thedielectric layer defines an opening or gap that extends a secondpredetermined length in a direction substantially parallel to thelongitudinal axis of the stack. The opening in the dielectric layer ispreferably aligned with a central region of the bottom surface of thepiezoelectric layer. The opening defines the elevation dimension of thearray. In one aspect, each element of the array has the same elevationdimension, and the width of the opening is constant within the area ofthe piezoelectric layer reserved for the active area of the device thathas formed kerf slots. In one aspect, the length of the opening in thedielectric layer can vary in a predetermined manner in an axissubstantially perpendicular to the longitudinal axis of the stackresulting in a variation in the elevation dimension of the arrayelements.

The relative thickness of the dielectric layer and the piezoelectriclayer and the relative dielectric constants of the dielectric layer andthe piezoelectric layer define the extent to which the applied voltageis divided across the two layers. In one example, the voltage can besplit at 90% across the dielectric layer and 10% across thepiezoelectric layer. It is contemplated that the ratio of the voltagedivider across the dielectric layer and the piezoelectric layer can bevaried. In the portion of the piezoelectric layer where there is nounderlying dielectric layer, then the full magnitude of the appliedvoltage appears across the piezoelectric layer. This portion defines theactive area of the array. In this aspect, the dielectric layer allowsfor the use of a piezoelectric layer that is wider than the active areaand allows for kerf slots to be made in the active area and extendbeyond this area in such a way that array elements and arraysub-elements are defined in the active area, but a common ground ismaintained on the top surface.

A plurality of first kerf slots are defined therein the stack. Eachfirst kerf slot extends a predetermined depth therein the stack and afirst predetermined length in a direction substantially parallel to thelongitudinal axis of the stack. The “predetermined depth” of the firstkerf slot may follow a predetermined depth profile that is a function ofposition along the respective length of the first kerf slot. The firstpredetermined length of each first kerf slot is at least as long as thesecond predetermined length of the opening defined by the dielectriclayer and is shorter than the longitudinal distance between the firstface and the opposed second face of the stack in a lengthwise directionsubstantially parallel to the longitudinal axis of the stack. In oneaspect, the plurality of first kerf slots define a plurality ofultrasonic array elements.

The ultrasonic transducer can also comprise a plurality of second kerfslots. In this aspect, each second kerf slot extends a predetermineddepth therein the stack and a third predetermined length in a directionsubstantially parallel to the longitudinal axis of the stack. The“predetermined depth” of the second kerf slot can follow a predetermineddepth profile that is a function of position along the respective lengthof the second kerf slot. The length of each second kerf slot is at leastas long as the second predetermined length of the opening defined by thedielectric layer and is shorter than the longitudinal distance betweenthe first face and the opposed second face of the stack in a lengthwisedirection substantially parallel to the longitudinal axis of the stack.In one aspect, each second kerf slot is positioned adjacent to at leastone first kerf slot. In one aspect, the plurality of first kerf slotsdefine a plurality of ultrasonic array elements and the plurality ofsecond kerf slots define a plurality of ultrasonic array sub-elements.For example, an array with one second kerf slot between two respectivefirst kerf slots has two array sub-elements per array element. For a64-element array with two sub-diced elements per array element, 129respective first and second kerf slots are made to produce 128piezoelectric sub-elements that make up the 64 elements of the array. Itis contemplated that this number can be increased for a larger array.For an array without sub-dicing, 65 and 257 first kerf slots can be usedfor array structures with 64 and 256 array elements respectively. In oneaspect, the first and/or second kerf slots can be filled with air. In analternative aspect, the first and/or second kerf slots can also befilled with a liquid or a solid, such as, for example, a polymer.

Because neither the first or second kerf slots extend to either of therespective first and second faces of the stack, i.e., the kerf slotshave an intermediate length, the formed array elements are supported bythe contiguous portion of the stack near the respective first and secondfaces of the stack.

The piezoelectric layer of the stack can resonate at frequencies thatare considered high relative to current clinical imaging frequencystandards. In one aspect, the piezoelectric layer resonates at a centerfrequency of about 30 MHz. In other aspects, the piezoelectric layerresonates at a center frequency of about and between 10-200 MHz,preferably about and between, 20-150 MHz, and more preferably about andbetween 25-100 MHz.

Each of the plurality of ultrasonic array sub-elements has an aspectratio of width to height of about and between 0.2-1.0, preferably aboutand between 0.3-0.8, and more preferably about and between 0.3-0.7. Inone aspect, an aspect ratio of width to height of less than about 0.6for the piezoelectric elements can be used. This aspect ratio, and thegeometry resulting from it, helps to separate lateral resonance modes ofan array element from the thickness resonant mode used to create theacoustic energy. Thus, the noted width to height ratios are configuredto prevent any lateral resonant modes within the piezoelectric bar frominterfering with the dominant thickness mode resonance. Similarcross-sectional designs can be considered for arrays of other types asunderstood by one skilled in the art. Each array element can comprise atleast one sub-dice kerf, such that each array element will effectivelyinclude two or more bars, in which the signal electrodes for all bars ofeach respective element are electrically shorted together.

The width to height aspect ratio of the piezoelectric bar can alsoimpact the directivity of the array element, i.e., the more narrow thewidth, the lower the directivity and the larger the steering angle ofthe array. For arrays with a pitch greater than about 0.5 lambda, theamplitude of the grating lobes produced for an aperture of drivenelements will increase. Without limitation, various exemplarywidth/height aspect ratios of PZT bars can include:

Approx Frequency Pitch PZT Kerf Range (μm) (μm) (μm) W/H 13-24 MHz 90 7510 0.53 18-42 MHz 75 51 8 0.58 18-42 MHz 60 45 5 0.55 22-55 MHz 55 39 50.58 22-55 MHz 55 39 5 0.58 30-70 MHz 38 25 3-4 0.56

The first and/or second kerf slots can be filled with air or with aliquid or a solid, such as a polymer. The filler can be a low acousticimpedance material that minimizes mechanical coupling between adjacentpiezoelectric bars within the array structure. If selected, the lowacoustic impedance material can have an acoustic response that isoutside of the bandwidth of the piezoelectric bars to avoid any unwantedcoupling with the piezoelectric bars. It will be appreciated that thechoice of filler can influence the effective width of an array element,i.e., the effective width of the array element will be equal to, orlarger than, the actual width of the array element due to any mechanicalcoupling between elements. Further, as the effective width increases,the directivity of the array element will increase slightly. Forexample, and not meant to be limiting, Epotek 301 and/or 301-2 epoxies,and the like, can be used as kerf filler materials.

The formation of sub-elements by “sub-dicing,” using a plurality offirst and second kerf slots is a technique in which two adjacentsub-elements are electrically shorted together, such that the pair ofshorted sub-elements act as one element of the array. For a givenelement pitch, which is the center to center spacing of the arrayelements resulting from the first kerf slots, sub-dicing allows for animproved element width to height aspect ratio such that unwanted lateralresonances within the element are shifted to frequencies outside of thedesired bandwidth of the operation of the device.

In one aspect, the piezoelectric layer of the stack has a pitch of aboutand between 7.5-300 microns, preferably about and between 10-150microns, and more preferably about and between 15-100 microns. In oneexample and not meant to be limiting, for a 30 MHz array design, theresulting pitch for a 1.5λ is about 74 microns.

At high frequencies, when the width of the array elements and of thekerf slots scale down to the order of 1-10's of microns, it is desirablein array fabrication to make narrow kerf slots. Narrowing the kerf slotscan minimize the pitch of the array such that the effects of gratinglobes of energy can be minimized during normal operation of the arraydevice. Further, by narrowing the kerf slots, the element strength andsensitivity are maximized for a given array pitch by removing as littleof the piezoelectric layer as possible. Using laser machining, thepiezoelectric layer may be patterned with a fine pitch and maintainmechanical integrity.

As noted above, the plurality of layers can further include a signalelectrode layer and a ground electrode layer. The electrodes can bedefined by the application of a metallization layer that covers thedielectric layer and the exposed area of the piezoelectric layer. Theelectrode layers can comprise any metalized surface as would beunderstood by one skilled in the art. A non-limiting example ofelectrode material that can be used is Nickel (Ni). A metalized layer oflower resistance (at 1-100 MHz) that does not oxidize can be depositedby thin film deposition techniques such as sputtering (evaporation,electroplating, etc.). A Cr/Au combination (300/3000 Angstromsrespectively) is an example of such a lower resistance metalized layer,although thinner and thicker layers can also be used. The Cr is used asan interfacial adhesion layer for the Au. As would be clear to oneskilled in the art, it is contemplated that other conventionalinterfacial adhesion layers well known in the semiconductor andmicrofabrication fields can be used. Signal electrodes can be patternedas described herein.

The plurality of layers of the stack can further include at least onematching layer having a top surface and an opposed bottom surface. Inone aspect, the plurality of layers includes two such matching layers.At least a portion of the bottom surface of the first matching layer canbe connected to at least a portion of the top surface of thepiezoelectric layer. If a second matching layer is used, at least aportion of the bottom surface of the second matching layer is connectedto at least a portion of the top surface of the first matching layer.The matching layer(s) can be at least as long as the secondpredetermined length of the opening defined by the dielectric layer in alengthwise direction substantially parallel to the longitudinal axis ofthe stack. Methods for producing integrated matching layers aredescribed herein.

The matching layer(s) can have a thickness that is usually equal toabout or around ¼ of a wavelength of sound, at the center frequency ofthe device, within the matching layer material itself. The specificthickness range of the matching layers depends on the actual choice oflayers, their specific material properties, and the intended centerfrequency of the device. In one example and not meant to be limiting,for polymer based matching layer materials, and at 30 MHz, this resultsin a preferred thickness value of about 15-25 μm.

In one aspect, the acoustic impedance of a matching layer can be between8-9 Mrayl; in another aspect, the impedance can be between 3-10 Mrayl;and, in yet another aspect, the impedance can be between 1-33 Mrayl.

The plurality of layers of the stack can further include a backing layerhaving a top surface and an opposed bottom surface. In one aspect, thebacking layer substantially fills the opening defined by the dielectriclayer. In another aspect, at least a portion of the top surface of thebacking layer is connected to at least a portion of the bottom surfaceof the dielectric layer. In a further aspect, substantially all of thebottom surface of the dielectric layer is connected to at least aportion of top surface of the backing layer. In yet another aspect, atleast a portion of the top surface of the backing layer is connected toat least a portion of the bottom surface of the piezoelectric layer.

The matching and backing layers can be selected from materials withacoustic impedance between that of air and/or water and that of thepiezoelectric layer. In addition, as one skilled in the art willappreciate, an epoxy or polymer can be mixed with metal and/or ceramicpowder of various compositions and ratios to create a material ofvariable acoustic impedance and attenuation. Any such combinations ofmaterials are contemplated in this disclosure. The choice of matchinglayer(s), ranging from 1-6 discrete layers to one gradually changinglayer, and backing layer(s), ranging from 0-5 discrete layers to onegradually changing layer alters the thickness of the piezoelectric layerfor a specific center frequency.

In one aspect, the backing layer of the transducer can be configuredsuch that the acoustic energy that travels downwards towards the backinglayer when the piezoelectric element is electrically excited, oroperated in receive mode, is absorbed by the backing material to avoidany unnecessary acoustic reflections within the thickness of theultrasonic transducer stack. In one aspect, to effect the desiredabsorption of the acoustic energy that enters the backing material, asingle backing material that has a high acoustic attenuation isconfigured to be sufficiently thick such that the layer acts as aninfinitely thick layer. If more than a single backing layer iscontemplated, to adjust the bandwidth and/or the characteristicfrequency response of the transducer in any way, then the acousticimpedances are to be chosen accordingly. In one exemplary aspect, thebacking layer can comprise a powder-doped epoxy.

In one aspect, a lens can be positioned in substantial overlyingregistration with the top surface of the layer that is the uppermostlayer of the stack. The lens can be used for focusing the acousticenergy. The lens can be made of a polymeric material as would be knownto one skilled in the art. In one preferred aspect, the lens can be madeof a material that is well matched to water and has a low acoustic loss.For example, a preformed or prefabricated piece of Rexolite which hasthree flat sides and one curved face can be used as a lens. The radiusof curvature (R) is determined by the intended focal length of theacoustic lens. For example not meant to be limiting, the lens can beconventionally shaped using computerized numerical control equipment,laser machining, molding, and the like. In one aspect, the radius ofcurvature is large enough such that the width of the curvature (WC) isat least as wide as the opening defined by the dielectric layer.Exemplary lens materials are polymethylpentene (e.g., TPX®) andcross-linked polystyrene (e.g., Rexolite®).

The speed of sound of Rexolite is greater than the speed of sound inwater; therefore, the lens is formed with a concave surface. The radiusof curvature of the lens defines the elevation focal depth of the array.For a focal length of 10 mm, the radius of curvature (R)=3.65 mm. In afurther aspect, the maximum depth of the curvature of the lens can beminimized to avoid trapping air pockets in the acoustic gel used duringimaging. In an additional aspect, the thinnest cross-sectional portionof the lens can be made as thin as possible such that the internalacoustic reflection that forms at the front face of the lens will remaintemporally close to the primary pulse. In a further aspect, the thinnestcross-sectional portion of the lens can be thick enough to pass IECpatient leakage current tests for BF and/or CF rating. In yet anotheraspect, the curvature of the lens can extend beyond the active area ofthe array in order to avoid any unwanted diffraction due to a lensboundary discontinuity. Exemplary focal depths and radius of curvatureof an exemplary Rexolite lens are:

Rexolite Approx Frequency Radius of Range Lens Focal Depth Curvature13-24 MHz 15 mm  5.45 mm 18-42 MHz 10 mm  3.65 mm 18-42 MHz 9 mm 3.30 mm22-55 MHz 7 mm 2.55 mm 22-55 MHz 6 mm 2.20 mm 30-70 MHz 5 mm 1.85 mm

In one preferred aspect, the minimum thickness of the lens substantiallyoverlies the center of the opening or gap defined by the dielectriclayer. Further, the width of the curvature is greater than the openingor gap defined by the dielectric layer. In one aspect, the length of thelens can be wider than the length of a kerf slot allowing for all of thekerf slots to be protected and sealed once the lens is mounted on thetop of the transducer device.

At least one first kerf slot can extend through or into at least onelayer to reach its predetermined depth/depth profile in the stack. Someor all of the layers of the stack can be cut through or intosubstantially simultaneously. Thus, a plurality of the layers can beselectively cut through substantially at the same time. Moreover,several layers can be selectively cut through at one time, and otherlayers can be selectively cut through at subsequent times, as would beclear to one skilled in the art. In one aspect, at least a portion of atleast one first and/or second kerf slot extends to a predetermined depththat is at least 60% of the distance from the top surface of thepiezoelectric layer to the bottom surface of the piezoelectric layer,and at least a portion of at least one first and/or second kerf slot canextend to a predetermined depth that is 100% of the distance from thetop surface of the piezoelectric layer to the bottom surface of thepiezoelectric layer.

At least a portion of at least one first kerf slot can extend to apredetermined depth into the dielectric layer and at least a portion ofone first kerf slot can also extend to a predetermined depth into thebacking layer. As would be clear to one skilled in the art, thepredetermined depth into the backing layer can vary from 0 microns to adepth that is equal to or greater than the thickness of thepiezoelectric layer itself. Laser micromachining through the backinglayer can provide a significant improvement in isolation betweenadjacent elements. In one aspect, at least a portion of one first kerfslot extends through at least one layer and extends to a predetermineddepth into the backing layer. As described herein, the predetermineddepth into the backing layer may vary. The predetermined depth of atleast a portion of at least one first kerf slot can vary in comparisonto the predetermined depth of another portion of that same respectivekerf slot or to a predetermined depth of at least a portion of anotherkerf slot in a lengthwise direction substantially parallel to thelongitudinal axis of the stack. In another aspect, the predetermineddepth of at least one first kerf slot can be deeper than thepredetermined depth of at least one other kerf slot.

As described above, at least one second kerf slot can extend through atleast one layer to reach its predetermined depth in the stack asdescribed above for the first kerf slots. The second kerf slots canextend into or through at least one layer of the stack as describedabove for the first kerf slots. If layers of the stack are cutindependently, each kerf slot in a given layer of the stack, whether afirst or second kerf slot can be in substantial overlying registrationwith its corresponding slot in an adjacent layer.

A transducer may also include a support member to provide mechanicalsupport for the various components of the transducers and to aid in thefabrication process.

The disclosed technology will now be described with respect to thetransducer configurations shown generally in FIGS. 1-23. An ultrasonictransducer includes a stack 800 having a first face 802, an opposedsecond face 804, and a longitudinal axis Ls extending between. The stackhas a plurality of layers, each layer having a top surface 828 and anopposed bottom surface 830. The plurality of layers of the stackincludes, for example, a piezoelectric layer 806, a dielectric layer808, and a plurality of matching layers. The dielectric layer may beconnected to and underlie at least a portion of the piezoelectric layer.In one example, the plurality of matching layers includes four matchinglayers in the stack.

The plurality of layers of the stack can further include a groundelectrode layer 810 that is disposed on the top surface of thepiezoelectric layer, a signal electrode layer 812, and a backing layer814.

As shown in FIGS. 1 and 3, the transducer stack defines an active areaand an inactive area, in which a dielectric layer is provided under theground electrode that acts as a potential divider and limits the voltageapplied across the piezoelectric layer. In the figure, the stackincludes the following layers in the active area (from top to bottom):

Zac 20 MHz 30 MHz 30 MHz 40 MHz 50 MHz Layer Material (MRayl) (μm) (μm)(Am) (μm) (μm) Lens Rexolite 2.47 250 mm (Minimum thickness) 4^(th)Matching CA 2.69 26.9 um 17.9 um 17.9 um 13.4 um 10.8 um Layer 3^(rd)Matching SiC 3.45 33.1 um 22.1 um 22.1 um 16.6 um 13.3 um Layer Epoxy2^(nd) W/SiC 5.50 26.3 um 17.5 um 17.5 um 13.1 um 10.5 um Matching EpoxyLayer 1^(st) Matching W 11.05 21.3 um 14.2 um 14.2 um 10.6 um  8.5 umLayer Epoxy Electrode Au 62.60 Thin Layer ~8000 Å Ground PiezoelectricPZT 33   75 um   51 um   45 um   39 um   25 um Signal Au 62.60 ~10000 ÅElectrode Backing PZT 8.50 >5 mm EpoxyIn the inactive area, the stack transducer includes the following layers(from top to bottom):

Zac 20 MHz 30 MHz 30 MHz 40 MHz 50 MHz Layer Material (MRayl)Thicknesses Thicknesses Thicknesses Thicknesses Thicknesses LensRexolite 2.47 <0.5 mm 4^(th) Matching CA 2.69 26.9 um 17.9 um 17.9 um13.4 um 10.8 um Layer Copper Foil Copper N/A   20 um   20 um   20 um  20 um   20 um 3^(rd) Matching SiC 3.45 As required As required Asrequired As required As required Layer Epoxy for active for active foractive for active for active area area area area area thickness tothickness to thickness to thickness to thickness be achieved be achievedbe achieved be achieved to be achieved 2^(nd) W/SiC 5.50 26.3 um 17.5 um17.5 um 13.1 um 10.5 um Matching Epoxy Layer 1^(st) Matching W 11.0521.3 um 14.2 um 14.2 um 10.6 um  8.5 um Layer Epoxy Ground Au 62.60 ThinLayer ~8000 Å Electrode Copper N/A Foil ~15-25um thick Dielectric SilicaN/A >20 um Epoxy Piezoelectric PZT 33   75 um   51 um   45 um   39 um  25 um Signal Au 62.60 ~10000 Å Electrode Backing PZT 8.50 >5 mm Epoxy

The piezoelectric layer 806 can be made of a variety of materials. Forexample and not meant to be limiting, materials that form thepiezoelectric layer can include ceramic, single crystal, polymer andco-polymer materials, ceramic-polymer and ceramic-ceramic compositeswith 0-3, 2-2 and/or 3-1 connectivity, and the like. In one example, thepiezoelectric layer includes lead zirconate titanate (PZT) ceramic.

As shown in FIGS. 6-7, the inner edges of the respective first andsecond ground electrodes can have a saw-tooth or stepped design thataids in avoiding any fault lines when the ground electrode is bonded tothe piezoelectric layer. In a further aspect, the outer edges of therespective first and second ground electrodes are configured to extendbeyond the respective longitudinal face edges of the piezoelectric layerso that they can be positioned as desired in electrical communicationwith a circuit board to form the desired ground connection. Thus, in oneaspect, part of the ground electrode layer typically remains exposed inorder to allow for the signal ground to be connected from the groundelectrode to the circuit board.

In a further aspect, the inner edges of the respective first and secondground electrodes are spaced from each other a distance sufficient forrespective first and second matching layers to be mounted sequentiallyon the top surface of the piezoelectric layer between the inner edges ofthe respective first and second ground electrodes. In this aspect, thelongitudinally extending edges of the first and second matching layers816, 826 can be spaced from the inner edges of the respective first andsecond ground electrodes. Optionally, a plurality of spacers 900 can beprovided that are positioned outside of the acoustic field as defined bythe active area of the stack onto portions of the top surface of therespective first and second ground electrodes. Each spacer 900 extendsupwardly a predetermined distance relative to the top surface of thepiezoelectric layer such that the bottom surface of a fourth matchinglayer 846 can be positioned at a desired distance relative to thepiezoelectric layer and the intervening first and second matchinglayers. In this aspect, one spacer can be positioned or formed on theinwardly extending portion of the saw-tooth inner edges of therespective first and second ground electrodes. In one aspect, uponcompletion of the assembly of the stack, the spacing generated by thespacers 900 is equal to the thickness of a third matching layer 836 ofthe stack. It is contemplated that the spacers can be made from anymaterial that can be lapped down to, or built up to, the targetthickness.

In one exemplary aspect, the dielectric material includes silica dopedEpotek 301 epoxy, which has a low relative dielectric constant of about4 and provides strong adhesion for sputtered gold when the dielectricsurface is treated with low fluence UV light and/or plasma. In a furtheraspect, the thickness of the dielectric can be at least 10 μm,preferably at least 10 μm, and more preferably at least 20 μm.Optionally, the edge of the dielectric layer can be sloped, with respectto the cross-sectional plane, to provide some apodization and to helpsuppress side lobes in elevation. The exact shape of the slope will beselected by one skilled in art based on the desired effect on theultrasound wave. In another aspect, the width of the gap in the dopedepoxy dielectric layer, which defines the elevation dimension of thearray, can preferably be between about 0.5 mm-3.5 mm, more preferablybetween about 0.75 mm-3.0 mm, and most particularly between about 1.0mm-3.0 mm.

The plurality of layers of the stack can further include at least onematching layer having a top surface and an opposed bottom surface. In afurther aspect, the acoustic impedance of each matching layer can beconfigured such that the acoustic impedance monotonically decreases fromthe first matching layer above the piezoelectric to the top matchinglayer just underneath the lens. In one exemplary aspect, at least one ofthe matching layers is polymer based. It is also contemplated that allof the matching layers can be polymer based. In a further aspect, theexemplary plurality of matching layers can result in a substantiallysmooth pulse response with no perceivable phase discontinuities. Thesmooth nature of the pulse response means that there is a predictablerelationship between the time and frequency response of the transducer.

In one exemplary illustrated aspect, the plurality of matching layerscomprises four such matching layers. In one exemplary aspect, at least aportion of the bottom surface of the first matching layer 816 can beconnected to at least a portion of the top surface of the groundelectrode layer, which is, as described above, mounted thereon the topsurface of the piezoelectric layer. At least a portion of the bottomsurface of the second matching layer 826 is connected to at least aportion of the top surface of the first matching layer. The first andsecond matching layers can be at least as long as the secondpredetermined length of the opening defined by the dielectric layer in alengthwise direction substantially parallel to the longitudinal axis ofthe stack.

As shown in FIGS. 8-9, a lens 809 can be positioned in substantialoverlying registration with the top surface of the matching layer thatis the uppermost layer of the stack. In this aspect, the lens is a fixedlens that can be used for focusing the acoustic energy. For example, apreformed or prefabricated piece of Rexolite, which can have three flatsides and one curved face, can be used as a lens. In a further aspect,the fixed lens 809 provides a means for focusing in elevation. Thethickness of the lens can be thicker than the piezoelectric or matchinglayers.

In one aspect, a top surface of a fourth matching layer 846 is bonded tothe bottom, flat face of the lens. In the embodiment in which the lensis formed from Rexolite, the fourth matching layer 846 can be made fromcyanoacrylate (CA) adhesive, which is a low acoustic material that canbe reliably bonded to the Rexolite lens, as described in U.S.Publication No. 2007/0205698. Of course, it is contemplated that any lowimpedance material that can be reliably bonded to the material of thedesired lens can be used. In one further aspect, it is preferred thatthe bottom surface of the CA layer, i.e., the fourth matching layer, isadhesively coupled to the top surface of the second matching layer. Inthis aspect, of the bottom surface of the fourth matching layer areseated on the top surface of the plurality of spacers such that the lenscan be positioned/spaced as the desired distance from the secondmatching layer. In this aspect, the adhesive layer provides for bondingthe lens to the stack.

The applied adhesive layer can also act as the third matching layer 836provided that the thickness of the adhesive layer applied to the bottomface of the lens is of an appropriate wavelength in thickness (such as,for example and not meant to be limiting, ¼ wavelength in thickness). Inthis example, it is contemplated that the choice of powder andconcentration of powder is selected to adjust the acoustic impedance tomatch the desired acoustic profile. One skilled in the art willappreciate that Epotek 301 epoxy, Epotek 301-2 epoxy, and the like canbe used as the adhesive layer to form the noted third matching layer.Epotek 301 epoxy has an acoustic impedance of 2.9 Mrayl in its purestate and can be doped with powders of different composition and size tocreate a 0-3 composite material that can be configured to have adesirable acoustic impedance by controlling the density and speed ofsound. In this exemplary aspect, the layer of CA acts as one of thematching layers of the transducer. Thus, in one non-limiting example,the plurality of matching layers can comprise a layer of CA and threeunderlying matching layers can comprise powder loaded Epotek 301 epoxy,Epotek 301-2 epoxy, and the like.

In a further aspect, prior to mounting the lens onto the stack, the CAlayer and the lens can be laser cut, which effectively extends the arraykerfs (i.e., the first and/or second array kerf slots), and in oneaspect, the sub-diced or second kerfs, through both matching layers (orif two matching layers are used) and into the lens. If the CA and lensare laser cut, a pick and place machine (or an alignment jig that issized and shaped to the particular size and shape of the actualcomponents being bonded together) can be used to align the lens in bothX and Y on the uppermost surface of the top layer of the stack. To lasercut the CA and lens, laser fluence of approximately 0.5-5 J/cm² can beused.

In various exemplary aspects, arrays have the following acoustic designcharacteristics:

Center Frequency 20 MHz 30 MHz 30 MHz 40 MHz 40 MHz 50 MHz Elements 256256 256 256 256 256 Pitch 90 um 75 um 60 um 55 um 55 um 38 um (1.2 (1.5(1.2 (1.4 (1.4 (1.2 lambda) lambda) lambda) lambda) lambda) lambda)Elevation 2.8 mm 2.0 mm 2.0 mm 1.4 mm 1.2 mm 1.0 mm Focal 15 mm 10 mm 9mm 7 mm 6 mm 5 mm Depth Pulse 60 ns 45 ns 45 ns 35 ns 35 ns 35 nsResponse (−6 dB) (−6 dB) (−6 dB) (−6 dB) (−6 dB) (−6 dB) 120 ns 90 ns 85ns 70 ns 70 ns 70 ns (−20 dB) (−20 dB) (−20 dB) (−20 dB) (−20 dB) (−20dB) 2-Way >65% >65% >65% >65% >65% >65% Bandwidth (−6 dB) (−6 dB) (−6dB) (−6 dB) (−6 dB) (−6 dB)Directivity >+/−15° >+/−15° >+/−15° >+/−15° >+/−15° >+/−15°

Example 1 Patterning of Electrodes

A flex circuit is placed on a 45 degree inclined plane with respect tothe plane of an ultrasound array, and each finger of the flex is linedup with a corresponding array element. Two pieces of flex, one on eachside of the array, are staggered, so that each flex is twice the pitchof the array. The flex is permanently attached in this position. Thewhole assembly is filled with a silica particle filled epoxy that coversall of the flex fingers. The epoxy is shaped to form a smooth internalprofile over the all of the array, so that there are no suddentransitions from one surface to another.

An excimer laser is then used (e.g., 248 nm) to selectively expose theactive region of the array by removing the particle/epoxy from thesurface of the piezoelectric, e.g., PZT along each element, using afluence that does not ablate the piezoelectric, but does remove theepoxy mixture. A ridge of kerf width is left between each element in theactive area. The epoxy mixture is then removed from over the flexfingers, exposing the copper of the flex. Trenches are then made fromeach element to its respective finger. The transducer is sputtered,covering the entire inner surface with 1 μm of gold. Any standard metalcould be used. A chromium adhesion layer may be used in conjunction withgold deposition. The laser ablation of the epoxy mixture and laseractivation of the piezoelectric improve the adhesion of the metal.

A standard positive photoresist is coated onto the gold. Because of thetrenches and ridges, the resist pools thickly in the trenches andremains thin on the high areas. The resist is allowed to dry but is nothard baked. The laser set to a very low fluence (about 0.3 J/cm²) isused to remove the resist without damaging the gold underneath. This isimportant, since ablation of the gold directly will typically causecollateral damage to the electrode left behind. Having thus exposed thenegative of the electrode pattern in the resist, the gold is etchedusing a standard wet gold etching process at slightly elevatedtemperatures of up to 50° C. for a few minutes. The result of this is tohave removed almost all of the gold down to the Cr/Au alloy region thatis only about 300 Angstroms thick.

The laser is used at a slightly higher fluence to remove the remainingmetal, e.g., about 0.8 J/cm². This fluence will remove the remainingmetal and created a trench in the epoxy under the gold layer. In theactive area where the kerfs are less than 5 μm, a third, high fluencepass (e.g., at about 3 J/cm²) may be used to remove shorts. The trenchmade with the 0.8 J/cm² pass acts as a guide for the plasma caused bythe laser pulses, thereby preventing collateral damage of the electrodethat would be caused by using a high fluence initially. After the finallaser pass, a short wet etch can be used to de-burr the laser cut edges.Finally the resist is removed by dissolving in a suitable solvent atroom temperature.

Example 2 Coupling a Transducer to Circuit

FIGS. 4-23 illustrate a methodology of preparing the transducer stackdescribed above and operably coupling the transducer stack to a circuitboard. Any of the embodiments described in the following may be employedgenerally with any method of the disclosed technology.

The piezoelectric layer, with a metalized ground electrode layer (notshown) coupled to the top surface of the piezoelectric layer, isinitially blocked and its bottom surface is lapped conventionally to afirst desired thickness in a first step. In one aspect, the firstdesired thickness is typically not the final thickness, but is rather athickness that allows the continued working of the piezoelectric layer.In a second step, the first matching layer 816 is applied to a portionof the top surface of the metalized ground electrode layer and, aftercuring, is lapped to a target thickness. In step, the second matchinglayer 826 is applied to a portion of the top surface of the firstmatching layer and is subsequently lapped to a target thickness aftercuring. In one aspect, both the first and second matching layers arepositioned substantially in the center of the piezoelectric layer andextend on the top surface of the piezoelectric layer between theelongate edges of the piezoelectric layer. The longitudinally extendingedges of the first and second matching layers 816, 826 can be spacedfrom the longitudinally extending edges of the piezoelectric layer.

Subsequently, a copper foil 910 is coupled, for example with aconductive adhesive, to a portion of the top surface of the metalizedground electrode layer. As shown in FIG. 6, the copper foil ispositioned to surround the first and second matching layerscircumferentially. In a further aspect, the copper foil 910, whichdefines the respective first and second ground electrodes, is alsopositioned such that the inner edges of the respective first and secondground electrodes are spaced from the longitudinally extending edges ofthe respective first and second matching layers. Still further, theoutward edges of the respective first and second ground electrodesextend outwardly beyond the longitudinal faces of the piezoelectriclayer so that they can be operatively coupled to the ground of thecircuit board in a latter step of the fabrication process. In a furtheraspect, as noted in the figure, the inner edges of the first and secondground electrodes can have a saw-tooth pattern that extends beyond thelongitudinal faces of the piezoelectric layer so that the respectivefirst and second ground electrodes can be readily bent along therespective longitudinal faces of the piezoelectric layer. As shown inFIG. 7, the respective ends of the copper foil are subsequently removedto physically separate the respective first and second groundelectrodes. In one aspect, a contiguous copper foil is useful for thebonding of the copper foil to the piezoelectric layer. Optionally, theindividual first and second ground electrodes could be mounted to thepiezoelectric layer individually, which would result in the samestructure as shown in FIG. 7. The first and second ground electrodeseffectively act as extensions of the metalized ground electrode layer.

In another aspect, to achieve a desired standoff from the top surface ofthe respective first and second ground electrodes, a plurality ofspacers 900 are positioned on portions of the top surface of therespective first and second ground electrodes 850 and 860. The pluralityof spacers 900 can be in the form of pillars or dots that are positionedabout the full perimeter of the piezoelectric layer. In another aspect,the plurality of spacers 900 can be positioned on portions of the topsurface of the respective first and second ground electrodes adjacent tothe inner edges of the respective first and second ground electrodes. Inyet another aspect, the plurality of spacers can be positioned outwardlyfrom the active area of the stack, i.e., in the inactive area of thestack. The spacers can be made from any conventional material that canbe lapped to the desired target thickness.

The fourth matching layer 846 is adhesively coupled to the lens 809 andis subsequently allowed to cure prior to being lapped to the desiredtarget thickness. In one exemplary aspect, the lens can includeRexolite, and the fourth matching layer can include a CA adhesive. In afurther aspect, the fourth matching layer can be applied to a Rexoliteblank and can be lapped to the desired target thickness prior tomachining the Rexolite blank into a lens.

Referring to FIGS. 1 and 8-10, the fourth matching layer 846 ispositioned on the top surfaces of the plurality of spacers to ensurethat the adhesive that is used to bond the lens/fourth matching layerwill form the third matching layer 836, which can have a desired targetthickness as the adhesive cures. In another aspect, the bondedlens/fourth matching layer can be positioned in the substantial centerof the stack in desired registration with the piezoelectric layer.

Referring now to FIG. 11, in one aspect, the bottom surface of thepiezoelectric layer can be lapped to a desired thickness prior to theformation of the first and second kerf slots. The first and second kerfslots are formed to the desired depth in the stack. The first and secondkerf slots are machined in the stack from the bottom side of the stack.In one aspect, the first and second kerf slots are laser machined intothe stack using a laser fluence of about and between 3-10 J/cm² andpreferably about 5 J/cm². This laser fluence is adequate to create thekerf aspect ratios that are desired in the piezoelectric layer of thestack.

Further, in one aspect, a pin marker fiducial can be scribed on thebottom surface of the piezoelectric layer by, for example and not meantto be limiting, laser machining. The pin marker fiducial can be, forexample, at least one marking, such as a plurality of crosses. The pinmarker, if used, can be used to correctly orient the stack with respectto the flex circuit in a subsequent downstream fabrication process. In afurther aspect, the pin marker fiducial should extend into the bottomsurface of the piezoelectric layer a depth that is sufficient for thepin marker fiducial to remain visible as the bottom surface of thepiezoelectric layer is lapped to its final target thickness. It ispreferred that the etch pattern of the pin marker fiducial extendsubstantially straight down such that the width of the pin markerfiducial does not change when the bottom surface of the piezoelectriclapped.

As shown in FIG. 11, in a further aspect, laser alignment markers 930can be scribed on the bottom surface of the piezoelectric layer by, forexample, laser machining. The laser alignment markers 930 can be atleast two markings, such as two crosses, one at either end of the stack.The laser alignment markers 930, if used, can be used to assist in thealignment and/or registration of the stack in subsequent downstreamfabrication processes. In a further aspect, the alignment markers shouldextend into the bottom surface of the piezoelectric layer a depth thatis sufficient for the markers to remain visible as the bottom surface ofthe piezoelectric layer is lapped to its final target thickness. It ispreferred that the etch pattern of the laser alignment markers extendsubstantially straight down such that the width of the laserregistration marker does not change when the bottom surface of thepiezoelectric is lapped.

Optionally, the formed first and second kerf slots are filled asdescribed above and the fill material is allowed to cure. Subsequently,the bottom surface of the piezoelectric layer is lapped to its finaltarget thickness, which results in a cross sectional view of the stackthat is illustrated in FIG. 10. One will appreciate that at this stageof the fabrication process, the dielectric layer, the signal electrodelayer, and the backing layer have not been formed.

Referring now to FIGS. 12A and 12B, an exemplary embodiment of a supportmember 940 is shown. The support member has a first longitudinallyextending side edge portion 942 and an opposed second longitudinallyextending side edge portion 944, each side edge portion having arespective inner surface 946 and an opposed outer surface 948, wherein aportion of the respective inner surfaces of the first and secondlongitudinally extending side edge portions are configured so that adistal portion of a circuit board, such as a flex circuit board, orcircuit board pair, such as shown in FIG. 23, can be connected thereto.Other flex designs with fewer traces can be used. For example, more flexcircuits would be required to sum up to a total of 256 traces. Thesupport member also has a medial portion extending between therespective the first and second longitudinally extending side edgeportions that define a central, longitudinally extending opening. Themedial portion also provides mechanical strength and integrity to thesupport, necessary since the support, when bonded to the stack, willprovide the mechanical support to prevent the stack from warping duringthe remainder of the assembly process. In one aspect, the first andsecond longitudinally extending side edge portions 942, 944 can bepositioned at an acute angle relative to each other or, optionally, theycan be positioned substantially parallel to each other or co-planar toeach other.

In one exemplary aspect, a plurality of circuit alignment features 960,such as the exemplified score lines illustrated in FIGS. 10-15, are cutor otherwise conventionally formed into portions of the bottom surfaceof the medial portion of the support member. In this aspect, theplurality of circuit alignment features can be positioned such that theyare adjacent to and/or extend to the respective first and secondlongitudinally extending side edge portions and/or the opening of thesupport member. One will appreciate that the plurality of circuitalignment features allows for the correct positioning of the distalportion of the lead frame (signal traces) of a circuit board, or circuitboard pair, with respect to the first kerf slots cut within the stack.It is contemplated that the plurality of circuit alignment features onopposing sides of the opening of the support member are offset relativeto each other by a distance equal to the pitch of the transducer arrayto allow for an alternating signal electrode pattern to be formedbetween the circuit board or circuit board pair and the array elements.In one aspect, the plurality of alignment features 960 can be formed ina separate step subsequent to mounting the stack to the support member.Optionally the plurality of alignment features can be formed prior tofixedly mounting the stack to the support member provided that thesupport can be mounted to the stack with adequate registration.

As shown in FIG. 13, the transducer stack is fixedly mounted thereto atleast a portion of the top surface of the medial portion of the supportmember 940, and circuit alignment features are formed such that thecircuit alignment features are positioned in registration with the arraykerfs of the piezoelectric layer. In one aspect, the stack assembly canbe adhesively bonded to the support member. It is contemplated that, inone aspect, the plurality of alignment features 960 can be formed in thesupport member in a separate step subsequent to fixedly mounting thestack to the support member. Optionally, the plurality of alignmentfeatures can be formed therein the support member prior to fixedlymounting the stack to the support member.

The respective bottom surface of the distal ends of the circuit boards,such as the flex circuit 950 shown in FIG. 16, are connected to therespective inner surfaces 946 of the first and second longitudinallyextending side edge portions 942, 944. In one aspect, the flex circuitcan be coupled to the support member by use of an adhesive, such as CAadhesive. The respective flex circuits are fixedly mounted to therespective inner surfaces of the first and second longitudinallyextending side edge portions in registration with the plurality ofcircuit alignment features 960 to insure that the circuits on therespective circuit boards are aligned with the kerfs of the arraytransducer to within less than about a 0.5 pitch tolerance.

As shown in FIG. 17, a dielectric layer (e.g., a composite material asdescribed herein) can be applied to the bottom portion of the array. Inan optional step, the fiducial marking can be masked off prior to theapplication of the dielectric layer. In one aspect, the dielectricmaterial can extend to cover the lead frame of the flex circuit, or flexcircuit pair attached to the support frame. In one aspect, it iscontemplated that the dielectric material could be applied separatelyfrom the dielectric material if so desired. In a further aspect, theprofile of the dielectric layer is centered relative to the short axisof the piezoelectric stack, and it is configured such that the thicknessof the dielectric layer that overlies the bottom surface of thepiezoelectric layer meets the minimum electrical requirements todeactivate the piezoelectric. In another aspect, the dielectric layercan be configured such that the surface transition from the flex circuitto the bottom surface of the piezoelectric layer has a controlledcross-sectional profile that is void of sharp edges or undercuts inpreparation for the deposition of the signal electrode layer. Thetransition of the dielectric from zero to target thickness allows for arelatively uniform thickness temporary conformal coating, such as, forexample and not meant to be limiting, a resist material, to be appliedon top of a blanket signal electrode layer, which allows for the use ofa photoablation lithography process to be used during the subsequentpatterning of the signal electrode layer.

In practice, it is preferred to apply the dielectric layer across thebottom portion of the piezoelectric stack as shown in FIG. 17 andsubsequently to use a laser at a low fluence to trim away the dielectricin the active area and to create the smooth transition as shown in FIG.18. Such a low fluence can safely and cleanly remove dielectric materialwithout significantly ablating metal oxide powders, PZT, or the Cu metalon the flex circuit. In the non-limiting case of an Excimer laser,operating at 248 nm, a reasonable fluence is in the range of 0.5-1.5J/cm². As described above, the formed opening in the dielectric layerdefines the elevation of the array and the opening can have thefollowing features: it can be narrower than the length of the first andsecond kerf slots relative to the short axis of the piezoelectric stackand/or it can be longer than the length of the plurality of first kerfsslots relative to the long axis of the piezoelectric.

Referring to FIGS. 19 and 20, the patterning of the signal electrodelayer and the electrical interconnect to the flex circuit, or flexcircuit pair, can be accomplished using conventional packagingtechniques such as, but not limited to photolithography and wirebonding,anisotropic conducting films and tapes, or direct contact between thestack and the flex leadframe. However, it is preferred that thepatterning of the signal electrode layer be accomplished using aplurality of steps that can be scaled to frequencies higher than 50 MHzwithin a minimal packaging footprint volume. In one aspect, the signalelectrodes are created by the following general steps (which aredescribed in more detail below): surface preparation for electrode bymeans of laser photoablation; vacuum depositing a blanket signalelectrode and shorting the bottom surface of the stack to all of thetraces of the flex circuit, i.e., shorting a 256 array element of thestack to all 256 traces of the flex circuit; and combining laserphotoablation lithography and chemical etching to pattern the isolatedelectrodes into the sputtered metal. In one aspect, it is contemplatedthat each signal electrode will be formed from gold (Au) and will beabout and between 0.5-1.5 μm thick; preferably about and between 0.6-1.2um thick, and more preferably about and between 0.8-1.0 μn thick. Thenoted thickness for the gold electrodes allows the gold to behave like amacroscopic or bulk metal layer and have desired ductile and malleableproperties, which increases the reliability of the device.

One will appreciate that a thin Cr, or Ti/W layer, of a few 100Angstroms thick can be conventionally used as an adhesion layer, or thatNichrome is used as a diffusion barrier, when depositing a Au electrode.Conventionally, the thickness of these additional layers is very thinrelative to the Au layer, and, in the case of alloying the metals byco-deposition, the amount of the alloy is not significant to impact thesignal electrode patterning techniques described below. It iscontemplated that all combinations of metal alloying is included whendescribing the patterning of the signal electrode.

Prior to depositing the signal electrode, a laser can be used to ensurethat the desired portion of the bottom portion of the piezoelectriclayer is fully exposed with no residual dielectric layer covering thepiezoelectric in the active area. Further, the laser can pattern thedielectric layer that overlies the first kerf slots to form elevatedridges. One will appreciate that the formed ridges above the first kerfsslots, in the active area, will help reduce the thickness of the appliedresist above the first kerf slots and allow the resist to pool above thepiezoelectric. This aids in providing for clean kerf patterning of thesignal electrode.

In another aspect, the laser can be used to form a shallow trench orsunken path that extends from each active element of the array to itsdesignated copper trace on the flex circuit leadframe. The trenches inthe dielectric from the active element to the flex circuit allow forresist to pool therein, which helps protect the Au during the patterningof the signal electrode. In yet another aspect, the laser can be used inthis step to remove the dielectric material above the copper traces ofthe respective flex circuits and cleanly expose the copper traces.

Optionally, the laser can be used to create a “rough” textured surfaceon the portions of the array transducer that will be covered by thesignal electrode. The textured surface can help to promote metaladhesion of the signal electrode to the surface, as described herein.

For an exemplary 256 element transducer array, the signal electrodelayer forms a signal electrode pattern that is made of 256 isolatedsignal electrodes. In one aspect, each isolated signal electrode canhave, in the active area of the stack, including the sloped transitionto the dielectric layer, a minimum electrode gap, that is approximatelyas wide as the width of the first kerf slots between neighboring arrayelements. This electrode gap can extend from one side of the dielectricgap to the other and is preferably positioned substantially directlyover the first kerf slots. Optionally, no electrode gap is requiredabove the sub diced kerfs, i.e., the second kerf slots, because the subdiced piezoelectric bars are electrically shorted together as describedabove. In another aspect, on top of the dielectric layer, each isolatedsignal electrode can be terminated on the dielectric layer by removingthe gold in between the two electrode gaps adjacent to each arrayelement. As shown in FIGS. 19 and 20, the termination pattern alternatesfrom left to right for each adjacent element and matches the flexcircuit leadframe. In an additional aspect, an extension of thetermination pattern from the stack onto the flex circuit can be providedon the top of the dielectric to complete the isolation of each signalelectrode from adjacent elements. As one will appreciate, the extensionof the termination pattern also alternates from left to right such thatthe extension falls in between two adjacent leads on the flex circuit.

In one embodiment, after the conventional deposition of an Au layer tothe prepared portions of the transducer, a multi-step laser ablation andetching process is used to create the intricate signal electrodepattern. In one exemplary aspect, the gold layer can be applied usingconventional sputtering techniques. In a first step, a resist layer isapplied to achieve a substantially even coat over the deposited goldlayer. The stack may be tipped or rocked to help ensure that the resistcoat is substantially even. In this aspect, it is contemplated that theresist will be allowed to dry at substantially room temperature.Elevated temperatures, below the soft baking temperature of the resistare also permitted provided that the temperature does not exceed thethermal budget or limits imposed by the materials and construct of thestack (for example and without limitation 50° C.). In a subsequent step,a laser, such as a laser using a low fluence of, for example, about 0.3J/cm², can photoablate the resist over only the full signal electrodepattern, such as for example the full 256 array element signal electrodepattern. In a subsequent step, the signal electrode pattern isconventionally etched to thin the applied gold layer. Withoutlimitation, this etching step can be exemplarily accomplished by warmingthe etching materials to 32° C. and etching for 3 minutes.

Subsequently, the laser can be applied substantially over the first kerfslots to help remove the majority of any residual metals that remainabove the first kerf slots. Further, in this step, it is contemplatedthat a portion of the fill material therein the first kerf slot adjacentto the bottom surface of the piezoelectric layer will be removed. As onewill appreciate, this removal of the fill material will create shallowtrenches in the fill material within the first kerf slots that extendbelow the plane of the bottom surface of the piezoelectric layer. In oneaspect, it is contemplated that the laser will use a medium fluence,i.e., about and between 0.3-0.8 J/cm², for this ablation step.

In a further aspect, it is contemplated that a general laser pass overthe flex circuit and other potentially exposed areas at a low fluencelevel, i.e., about and between 0.3 and 0.4 J/cm², can be accomplishedafter each laser ablation step. This low fluence pass of the laser canhelp ensure that any residual, undesired post etched sputtered gold hasbeen removed.

In an optional additional step, the laser can be additionally be appliedat a high fluence for a minimal number of pulses over the first kerfslots and over the termination pattern to remove any burs that may havepersisted at this stage of the signal electrode formation process. Asone will appreciate, any sunken feature that had previously been formedcan aid in protecting the deposited signal electrodes from the plasmaplume created during the elevated fluence laser ablation process.

As one will appreciate, after the processing described above, eachsignal electrode is operatively mounted to the transducer and iselectrically coupled to both an individual circuit of the flex circuitand an individual array element. Optionally, the signal electrodes aretested for shorts so that any short can be identified and targetedrework can be accomplished to rectify the identified shorts.

Optionally, an additional etching step can be performed to debur thesignal electrode pattern. Without limitation, this etching step can beaccomplished by warming the etching materials to 32° C. and etching for1 minute. This step can aid in removing any final residuals that couldrisk causing shorts when the backing layer is applied. Finally, theresist is cleaned from the transducer/support member/flex circuitassembly, i.e., the array assembly, and the signal electrodes are againtested for shorts so that any short can be identified and targetedrework can be accomplished to rectify the identified shorts.

As shown in FIG. 21, the backing layer is applied to complete the arrayassembly. In one aspect, the backing layer can be positioned to coverand to extend beyond the active area of the stack. In a further aspect,the backing layer can substantially fill the cavity that is definedtherein the support member between the respective inner surfaces of thefirst and second longitudinally extending side edge portions of thesupport member.

In an additional step and referring to FIGS. 22A and 22B, the signalreturn path from the stack to the coupled flex circuits should beoperably coupled prior to the formation of the signal electrodes. Thisallows for the electrical integrity of the signal electrode to be testedafter the signal electrode pattern has been created. In one aspect aconductive material, such as, copper tape and the like, is positioned onthe array assembly to electrically couple the respective first andsecond ground electrodes to the respective grounds on the flex circuits.The copper tape can be bonded with additional conductive epoxy materialor low temperature solder to form a reliable electrical contact. Thus,in one example, the signal return path from the assembly extendsgenerally parallel to the kerfs to the end of the stack, up through theconductive epoxy bond line into the copper foil and then onto the flexcircuit via the additional conductive path of the exemplary copper tape.

As discussed above, depending on the desired frequency of operation fora transducer, the distance between adjacent transducer elements in anultrasonic transducer array can be required to be smaller than theminimum distance at which manufacturers can create traces in a printedflex circuit. One solution to this problem is to use two printed flexcircuits to connect to opposite sides of the transducer elements asdiscussed above. In this case, one printed flex circuit has traces thatconnect to even numbered transducer elements while the other printedflex circuit has traces that connect to odd numbered transducerelements. In this manner, the traces of each printed flex circuit boardonly need to connect to every other transducer element, thereby allowingthem to be placed farther apart on the printed flex circuit. While thismethod works well for some embodiments, there are transducer arrayswhere the pitch of the transducer elements is still too fine to connectevery other transducer element to a trace on a printed flex circuit.

To address this problem, one embodiment of the disclosed technologyconnects the transducer elements to traces in a multi-layer printed flexcircuit. This is particularly useful for embodiments of the technologythat are designed to be formed into probes that enter a subject's body.

FIG. 24 illustrates an ultrasonic transducer assembly 1200 in accordancewith an embodiment of the disclosed technology that is designed to beincorporated into a probe for insertion into a subject. For example, theultrasonic transducer assembly 1200 may be designed be incorporated intoa vaginal or rectal probe. The transducer assembly 1200 generallyincludes an array of transducer elements 1220 that are separated by asmall kerf. In the embodiment shown, the transducer array 1220 isgenerally rectangular in shape with a length dimension 1222 and a widthdimension 1224 that is shorter than the length dimension. A pair ofprinted flex circuits 1240, 1260 are electrically and mechanicallyconnected to the array of transducer elements 1220. The printed flexcircuits 1240, 1260 have traces therein that are electrically coupled ata distal end to a transducer element and extend along the length of theflex circuits to connect at a proximal end to additional signalprocessing equipment (not shown).

In one embodiment, adjacent transducer elements in the transducer arrayare separated by a distance that is smaller than a minimum distance atwhich traces can be printed on a single layer of a printed flex circuit.In some embodiments, the traces of the printed flex circuits have toturn approximately 90 degrees between the points where they areelectrically connected to a transducer element in order to extend alongthe length of the printed flex circuit. If an ultrasound transducer has512 active transducer elements, then each printed flex circuit 1240,1260 has to route 256 individual traces down its length. Because thesize of the flex circuit is directly proportional to the number ofconductive traces it carries, an increase in the width of the flexcircuit causes a corresponding increase in the size of a probe thathouses the flex circuits.

To address one or more of these problems, one embodiment of thedisclosed technology uses multi-layer printed flex circuits to connectto the transducer elements. For example, if two-layer printed flexcircuits are used, then each layer only needs to have traces that arespaced apart by the distance between 3 adjacent transducer elements (or5 adjacent transducer elements if a two-layer printed flex circuitconnects to only even or odd transducer elements). If three-layerprinted flex circuits are used, the traces on any one layer need only beas close as the distance between 4 adjacent transducer elements (or 7adjacent transducer elements if a printed flex circuit connects to onlyeven or odd transducer elements). Similarly, if a four-layer printedflex circuit is used, then the traces on each layer of the printed flexcircuit need only be as close as the distance between 5 adjacenttransducer elements (or 9 adjacent transducer elements if the printedflex circuit connects to only even or odd transducer elements).

By allowing the traces to be spaced farther apart on the printed flexcircuits, it is easier to manufacture and route the traces on theprinted flex circuits. The traces of the different layers of the printedflex circuits can then be interleaved and aligned at the point wherethey connect to the transducer elements such that they have the correctpitch to connect to the transducer elements. However, within any singlelayer of the multi-layer printed flex circuit, the trace pitch can begreater than the transducer element pitch because adjacent traces withinthe single layer do not need to connect to adjacent transducer elements.Rather the traces may be separated by a distance that is proportional tothe number of layers in the multi-layer printed circuit. In addition,the conductive traces of one layer are offset from the conductive tracesof adjacent layers. This improves electrical isolation of the traces,thereby improving trace impedance and reducing signal cross-talk betweentraces. The printed flex circuit may also include one or more groundplane layers (not shown) between the signal trace layers to furtherreduce cross-talk.

By using multi-layer printed flex circuits, the size of the flex circuitwithin the probe is reduced by a factor equal to the number of layers inthe multi-layer printed flex circuit. For example, if a four layerprinted flex circuit is used, then the flex circuit width can be ¼ aswide as if a single layer printed flex circuit were used. This reductionin flex circuit width allows probes to be made thinner for improvedpatient comfort.

In one embodiment, the printed flex circuits may be manufactured with alithography process to create the traces in each layer. The trace andground plane layers are then interleaved, aligned and bonded together toform a multi-layer printed flex circuit.

FIG. 25 illustrates an exemplary ultrasonic transducer assembly 1200where the array of transducer elements 1220 are electrically coupled toa four-layer printed flex circuit 1240. In the embodiment shown, theprinted flex circuit 1240 has four layers 1242, 1244, 1246 and 1248 eachhaving traces therein that are electrically coupled to a correspondingtransducer element. In some cases, the transducer array 1220 has moretransducer elements than there are traces in the multi-layer printedflex circuit. In addition, there may be traces in the printed flexcircuit that do not carry signals. These additional dummy transducerelements in the array and traces in the printed flex circuit aretypically found at the end of the transducer arrays and can help ensurethe each active element in the transducer array has electrically similarneighbors.

In the example shown, the first active transducer element in the arrayis connected to a trace in the third layer 1246 of a multi-layer printedflex circuit on one side of the transducer array. The next activetransducer element connects to a trace in the fourth layer 1248 in themulti-layer printed flex circuit on the same side of the transducerarray. The next active transducer element connects to a trace in thefirst layer 1242 and the next active transducer element connects to atrace in the second layer 1244. In one embodiment, the pattern thenrepeats with the next active transducer element connecting to a trace onthe third layer 1246 etc.

By using a four-layer printed flex circuit, the traces on any givenlayer need do not need to be spaced any closer than the distance betweennine adjacent transducer elements (assuming the multi-layer printed flexcircuit only connects to odd or even transducer elements). The traces onthe various layers of the multi-layer printed flex circuit areinterleaved and aligned such that they align with the 1st, 3rd, 5th, 7thetc. active transducer elements etc. Although not shown in FIG. 25, itwill be appreciated that the traces in each layer turn approximately 90degrees from the orientation where they are aligned with the individualtransducer elements in order to run along the length of the printed flexcircuit 1240.

In one embodiment, the traces from the various layers of the printedflex circuit are electrically coupled to a transducer element using thetechniques described above. That is, the traces of the multi-layer flexcircuit are placed in a frame and aligned with the transducer elementsof the array. The flex circuit is then bonded at an angle to theultrasonic transducer using a particulate (e.g. silica) filled epoxy.The epoxy is machined or molded such that there are no abrupttransitions formed between the transducer elements 1220 and the printedflex circuit.

A low fluence laser then cuts smooth trenches in the epoxy that extenddown through the epoxy layer to the ultrasonic transducer elements andup the side of the multi-layer printed flex circuit. In the spot wherethe trench is positioned over the correct layer in the multi-layer flexcircuit, the laser burns down though the epoxy to expose a portion ofthe conductive trace in that layer.

The trenches on the printed flex circuit and transducer elements arethen sputtered covered with a very thin layer of conductive metal (e.g.gold or gold with a chromium adhesion layer). The conductive metal isthen covered with a resist that is allowed to dry. A low fluence laseris then used to remove the dried resist in areas where the gold or otherconductive metal is undesired (e.g. between the traces on the printedflex circuit and in the kerf regions between the transducer elements.

The exposed conductive metal is then mostly removed with a wet etchprocesses. Any remaining metal is then cleaned up and removed with oneor more passes with a laser. Finally, the remaining resist that coversthe areas where the conductive metal is desired is removed by dissolvingit with a suitable solvent thereby leaving only a number of conductivemetal lines that connect an ultrasound transducer element to a trace ona layer of the multi-layer printed flex circuit.

FIGS. 26A and 26B illustrate a cross-sectional view of a multi-layerprinted flex circuit 1240. In one embodiment, the printed flex circuitis held in place to the array of transducer elements by a frame 1300that is angled at, for example, about 45 degrees to the plane of thefront face of the transducer elements 1220. In one embodiment, thelayers 1242, 1244, 1246 and 1248 of the multi-layer printed flex circuithave traces that extend to the edge of each layer. The layers are placedover each other and staggered so that they look like a staircase whenviewed from the side. The traces in each layer are interleaved to alignwith the pitch of the transducer elements when viewed from above.

A silica filled epoxy 1270 is coated over the flex circuit to bond it tothe ultrasound transducer and the frame 1300 as well as to add strength.A laser is then used to cut trenches 1272, 1274, 1276, 1278 into theepoxy 1270 to expose a portion of the copper (or other conductive metal)traces in the flex circuit 1240. Once the trenches are cut, they arecoated with conductive metal film to electrically couple the traces to acorresponding transducer element as described above.

It is not required that two multi-layer printed flex circuits be used toconnect to an ultrasound transducer array. Depending on the pitch of thetransducer elements and the ability of the printed flex circuitfabricator to route traces in the flex circuit, a single multi-layerflex circuit can be used. FIG. 27 illustrates an embodiment of anultrasonic transducer assembly where a number of ultrasonic transducerelements 1600 are connected to a single, two-layer printed flex circuit1650. In this embodiment, the spacing between the traces on any layer ofthe two-layer printed flex circuit is the distance between threeadjacent transducer elements. In such an embodiment, the traces in thefirst layer 1652 connect to the even transducer elements and the tracesin the second layer 1654 connect to the odd transducer elements or viceversa. As will be appreciated, the printed flex circuit 1650 may alsohave more than two layers (e.g. three or more layers) if desired.

In order to reduce cross-talk between the leads that couple thetransducer elements to the traces in the printed flex circuits, it maybe desirable to reduce the width of the connections that connect thetransducer elements to the traces in the flex circuit. As shown in FIG.28, an ultrasonic transducer has an array of transducer elements 1220that are connected by leads 1702, 1704, 1706 etc. to traces within amulti-layer printed flex circuit. If the connections were as wide as thetransducer elements, they would be almost touching, which may contributeto cross-talk between the connections or impedance issues. Therefore, inone embodiment of the disclosed technology, the laser that cuts thetrenches in the silica/epoxy mix makes the trenches narrower in the areaof the printed flex circuit. In the example shown, it can be seen thatthe leads 1702, 1704 etc. are narrower than the transducer elements towhich they are connected.

It is also not required that the traces in the printed flex circuits runin a direction that is generally parallel to the length of theultrasonic transducer. FIG. 29 shows an exemplary four-layer printedflex circuit 1800 having traces therein that extend in a direction thatis generally aligned with the width of the transducer. The printed flexcircuit 1800 can be used in environments where it is not necessary tohave a side firing transducer array. The multi-level printed flexcircuit 1800 still allows the traces of each layer of the flex circuitto be positioned farther apart than the distance between adjacenttransducer elements in the transducer array.

Other Embodiments

Throughout this application, various publications are referenced. Thedisclosures of these publications in their entireties are herebyincorporated by reference. Unless otherwise expressly stated, it is inno way intended that any method set forth herein be construed asrequiring that its steps be performed in a specific order. Accordingly,where a method claim does not actually recite an order to be followed byits steps or it is not otherwise specifically stated in the claims ordescriptions that the steps are to be limited to a specific order, it isno way intended that an order be inferred, in any respect. This holdsfor any possible non-express basis for interpretation, including:matters of logic with respect to arrangement of steps or operationalflow; plain meaning derived from grammatical organization orpunctuation; and the number or type of embodiments described in thespecification.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosedtechnology without departing from the scope or spirit of the disclosedtechnology. Other embodiments of the disclosed technology will beapparent to those skilled in the art from consideration of thespecification and practice of the disclosed technology disclosed herein.It is intended that the specification and examples be considered asexemplary only, with a true scope and spirit of the disclosed technologybeing indicated by the following claims.

1. An ultrasonic transducer assembly comprising: a transducer arraycomprising a number of spaced transducer elements; at least one printedcircuit including two or more stepped trace layers, each layer having aplurality of conductive traces therein the ends of which areelectrically coupled to a corresponding transducer element, wherein theends of the conductive traces in any single trace layer at a point wherethe traces are coupled to the transducer elements are spaced fartherapart than a distance between adjacent transducer elements in thetransducer array; and a plurality of interconnections, eachinterconnection electrically coupling a conductive trace in a tracelayer the printed circuit to a corresponding transducer element.
 2. Theultrasonic transducer assembly of claim 1, wherein the interconnectionshave a width that is narrower than a width of the transducer elements towhich they are connected.
 3. The ultrasonic transducer assembly of claim1, wherein the transducer array has a length and a width that is shorterthan the length, and wherein the printed circuit has traces therein thatextend along the printed circuit in a direction that is generallyparallel to the length of the transducer array.
 4. The ultrasonictransducer assembly of claim 1, wherein the transducer array has alength and a width that is shorter than the length, and wherein theprinted circuit has traces therein that generally extend in a directionof the width of the transducer array.
 5. The ultrasonic transducerassembly of claim 1, wherein the transducer assembly includes a singleprinted circuit connected to one side of the transducer elements.
 6. Theultrasonic transducer assembly of claim 1, wherein the transducerassembly includes two printed circuits connected to opposite sides ofthe transducer elements.
 7. The ultrasonic transducer assembly of claim1, wherein the printed circuit includes at least one ground plane thatseparates at least two layers of the plurality of trace layers.
 8. Theultrasonic transducer assembly of claim 1, wherein neighboringtransducer elements of the transducer array are electrically connectedto conductive traces disposed in different trace layers of the printedcircuit.
 9. The ultrasonic transducer assembly of claim 1, wherein theprinted circuit is a printed flex circuit.
 10. An ultrasonic transducerassembly comprising: an ultrasonic transducer array comprising a set ofeven transducer elements and a set of odd transducer elementsalternating with the even transducer elements, the even transducerelements and the odd transducer elements having a pitch therebetween; atleast two multi-layer printed circuits, each multi-layer printed circuitcomprising a plurality of stepped trace layers having a conductivetraces therein, wherein the conductive traces on each of the multi-layerprinted circuits are interleaved such the traces have a pitch equal tothe pitch of the even or odd transducer elements but the traces in anysingle trace layer of multi-layer printed circuits have a pitch that isgreater than the pitch of the even or odd transducer elements; and aplurality of interconnections, each interconnection coupling aconductive trace of the multi-layer printed circuit to a transducerelement.
 11. The ultrasonic transducer assembly of claim 10, wherein thetransducer array has a length and a width that is shorter than thelength and wherein the traces in the multilayer printed circuitsgenerally extend in a direction of the width of the transducer array.12. The ultrasonic transducer assembly of claim 10, wherein thetransducer array has a length and a width that is shorter than thelength and wherein the traces in the multi-layer printed circuits extendin a direction that is generally aligned with the length of thetransducer array.
 13. The ultrasonic transducer assembly of claim 10,wherein the multi-layer printed circuits include at least one groundlayer that separates at least two trace layers in the printed circuit.14. The ultrasonic transducer assembly of claim 10, wherein neighboringtransducer elements of the transducer array are electrically connectedto conductive traces disposed on different mufti-layer printed circuits.15. The ultrasonic transducer assembly of claim 10, wherein the at leasttwo multi-layer printed circuits are multi-layer printed flex circuits.16. A multi-layer printed circuit for use in connecting to transducerelements of an ultrasonic transducer having a number of adjacenttransducer elements that are separated by a pitch distance, comprising:at least two stepped trace layers having a plurality of conductivetraces therein whereby the conductive traces in each trace layer areseparated by a distance that is greater than the pitch between adjacenttransducer elements at a point where they are to be connected to thetransducer elements but the conductive traces from each of the at leasttwo trace layers are interleaved such that the traces match the pitch ofthe transducer elements.
 17. The multi-layer printed circuit of claim16, further comprising at least one additional layer, the at least oneadditional layer including an additional plurality of conductive traces.18. A method of assembling an ultrasonic transducer assembly, by:securing a multi-layer printed circuit to an ultrasound transducer arraywith an adhesive, wherein the multi-layer printed circuit is of the typethat has at least two stepped trace layers having a plurality ofconductive traces therein that are separated by a distance that isgreater than a pitch between adjacent transducer elements in thetransducer array but the conductive traces from each of the at least twolayers are interleaved such that the traces from all of the at least twotrace layers match the pitch of the transducer elements in thetransducer array; creating channels in the adhesive between thetransducer elements and the traces in the multi-layer printed circuit;depositing a conductor material over the ultrasound array and at least aportion of the multi-layer printed circuit that has been channeled;placing a resist material over the conductor material; removing aportion of the resist material where the conductor material is notdesired; etching the conductor material to remove most of the conductormaterial where it is not desired; and removing any additional conductormaterial where it is not desired with a laser.